Aging investigation of the latest standard dual power modules using improved interconnect technologies by power cycling test-Reference-Cited by-同舟云学术

Aging investigation of the latest standard dual power modules using improved interconnect technologies by power cycling test

Published:2022-11 Issue: Volume:138 Page:114740
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Zhang Yi,Wu Rui,Iannuzzo Francesco,Wang Huai

Funder

Danmarks Frie Forskningsfond

Infineon Technologies

Independent Research Fund Denmark

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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3. Ultra-fast switching 3 . 3kV SiC high-power module;Kicin,2020

4. XHPTM 2 – the low-inductive, multi-package housing for the next generation of high-power applications;Brekel,2020

5. The next generation of high power IGBT modules;Radke;Bode’s Power Syst.,2019

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