Thermal investigation of LED lighting module

Author:

Choi Jong Hwa,Shin Moo Whan

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference15 articles.

1. Thermal analysis of LED array system with heat pipe;Kim;Thermochim. Acta,2007

2. High power LEDs – technology status and market applications;Steranka;Phys. Stat. Sol. (a),2002

3. M. Georage Craford, LEDs for solid state lighting and other emerging applications: status, trends, and challenges, in: Proceeding of the International Society for Optical Engineering 2005, SPIE, 5941 594101_1-594101_10, 2005.

4. A method for projecting useful life of LED lighting systems;Hong;Proc. Soc. Photo-Opt. Inst. Eng.,2004

5. Mechanism and thermal effect of delamination in Light-Emitting Diode Packages;Hu;Microelectron. J.,2007

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