Author:
Mattila T.T.,Li Jue,Kivilahti J.K.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference43 articles.
1. Karppinen J, Mattila TT, Kivilahti JK. Formation of thermomechanical interconnection stresses in a high-end portable product. In: The proceedings of the 2nd electronics system integration technology conference, London, UK, September 1–4, 2008, IEEE/EIA CPMT; 2008. p. 1327–32.
2. A review of mechanical properties of lead-free solders for electronic packaging;Ma;J Mater Sci,2009
3. Experimental damage mechanics of microelectronic solder joints under fatigue loading;Basaran;Mech Mater,2004
4. The impact of thermal cycling regime on the shear strength of lead-free solder joints;Dusek;Solder Surface Mount Technol,2005
5. Tang H, Basaran C, Dishongh T. Experimental characterization of material degradation of solder joint under fatigue loading. In: The proceedings of the 8th intersociety conference on thermal and thermomechanical phenomena in electronic systems, San Diego, CA, May 29–June 1, 2002, IEEE. p. 896–902.
Cited by
26 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献