Wafer-level Cu–Cu bonding technology
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Elsevier BV
Reference42 articles.
1. Reif Rafael, Fan Andy, Chen Kuan-Neng, Das Shamik. Fabrication technologies for three-dimensional integrated circuits. In: Proceedings of the international symposium on quality electronic design (ISQED); 2002. p. 33.
2. Copper wafer bonding;Fan;Electrochem Solid-State Lett,1999
3. McMahon JJ, Lu J-Q, Gutmann RJ. Wafer bonding of damascene-patterned metal/adhesive redistribution layers for via-first three-dimensional (3D) interconnect. In: Proceedings of electron components and technology (ECTC); 2005. p. 331–6.
4. Room temperature Cu–Cu direct bonding using surface activated bonding method;Kim;J Vac Sci Technol A,2003
5. Room temperature ultra-fine pitch and low-profiled Cu electrodes for bumpless interconnect;Shigetou;Transducers,2003
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