A novel decapsulation technique for failure analysis of epoxy molded IC packages with Cu wire bonds-Reference-Cited by-同舟云学术

A novel decapsulation technique for failure analysis of epoxy molded IC packages with Cu wire bonds

Published:2012-04 Issue:4 Volume:52 Page:725-734
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Liu Chien-Pan,Liu Yen-Fu,Li Chang-Hung,Cheng Hung-Chieh,Kung Yi-Chun,Lin Jeng-Yu

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference21 articles.

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3. Improved technique for decapsulation of epoxy packaged semiconductor devices and microcircuits;Wensink;Microelectron Reliab,1980

4. Li X, Hulog J, Massoodi M. Automatic decapsulation system utilizing an integrated spacer/protection plate. US patent; 2003. 6517666 B2.

5. Laser assisted decapsulation of plastic encapsulated devices;Kruger;Microelectron Reliab,2003

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