Reliable single-phase micro-joints with high melting point for 3D TSV chip stacking-Reference-Cited by-同舟云学术

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Reliable single-phase micro-joints with high melting point for 3D TSV chip stacking

Published:2020-07 Issue: Volume:828 Page:154468
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Tian Ye,Fang Heng,Ren Ning,Zhao Yatao,Chen Boli,Wu Fengshun,Paik Kyung-Wook

Funder

National Natural Science Foundation of China

Science and Technology Program of Henan Province

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference29 articles.

1. Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology;Tu;Mater. Sci. Eng. R Rep.,2019

2. Development of nanotwins in electroplated copper and its effect on shear strength of tin/copper joint;Lee;J. Alloys Compd.,2018

3. Scaling effect of interfacial reaction on intermetallic compound formation in Sn/Cu pillar down to 1μm diameter;Liu;Acta Mater.,2016

4. Full intermetallic joints for chip stacking by using thermal gradient bonding;Yang;Acta Mater.,2016

5. Microstructural evolution of lead-free solder joints in ultrasonic-assisted soldering;Ji;J. Electron. Mater.,2016

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1. Effect of thermal aging on joint with eutectic SnIn solder by TLP bonding;Materials Science in Semiconductor Processing;2025-01

2. A Cu/Ni/Cu/Sn1.8Ag microbump structure for void-free interface under long time high-temperature storage;Journal of Alloys and Compounds;2024-11

3. Stored energy density solution for TSV-Cu structure deformation under thermal cyclic loading based on PINN;International Journal of Plasticity;2024-08

4. A Review of Mechanism and Technology of Hybrid Bonding;Journal of Electronic Packaging;2024-07-25

5. Optimizing temperature gradient for rapid fabrication of Cu/Sn/Cu full intermetallic compounds joints via vacuum thermal compression bonding;Journal of Materials Science: Materials in Electronics;2024-04

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