Electrochemical corrosion behavior of Sn-0.7Cu solder alloy with the addition of bismuth and iron-Reference-Cited by-同舟云学术

Electrochemical corrosion behavior of Sn-0.7Cu solder alloy with the addition of bismuth and iron

Published:2019-11 Issue: Volume:810 Page:151925
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Jaffery Hasan Abbas,Sabri Mohd Faizul Mohd^ORCID,Said Suhana Mohd^ORCID,Hasan Syed Waqar,Sajid Imran Haider,Nordin Nor Ilyana Muhd,Megat Hasnan Megat Muhammad Ikhsan,Shnawah Dhafer Abdulameer,Moorthy Chellapilla VKNSN.^ORCID

Funder

University of Malaya under the UMRG Fund

Tin Industry (Research and Development) Board, Malaysia

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference41 articles.

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2. Microstructure of Sn–1Ag–0.5 Cu solder alloy bearing Fe under salt spray test;Nordin;Microelectron. Reliab.,2014

3. Electrochemical behavior of a lead-free Sn–Cu solder alloy in NaCl solution;Osório;Corros. Sci.,2014

4. The thermal property of lead-free Sn-8.55Zn-1Ag-XAl solder alloys and their wetting interaction with Cu;Cheng;J. Electron. Mater.,2002

5. Microstructure, corrosion behaviour and microhardness of a directionally solidified Sn–Cu solder alloy;Osório;Electrochim. Acta,2011

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