1. Introduction to copper and copper alloys;Tyler,1992
2. Enhancing the ductility of Laser-Welded Copper-Aluminum connections by using adapted filler materials;Weigl;Physics Procedia,2011
3. Growth rate of intermetallic compounds in Al/Cu bimetal produced by cold roll welding process;Abbasi;J. Alloys Compd.,2001
4. Effect of electrical current on the morphology an kinetics of formation of intermetallic phases in bimetallic aluminum-copper joints, electrical contacts;Braunovic,1993
5. W.M. Thomas, E.D. Nicholas, J.C. Needham, M.G. Church, P. Templesmith, C.J. Dawes, Patent application no. 9125978.8, (1991), US patent 5460317.