High-temperature creep and hardness of eutectic 80Au/20Sn solder
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference18 articles.
1. Comparison Between Epi-Down and Epi-Up Bonded High-Power Single-Mode 980-nm Semiconductor Lasers
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4. AuSn alloy phase diagram and properties related to its use as a bonding medium
5. Highly reliable Au-Sn eutectic bonding with background GaAs LSI chips
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