Investigating the effect of isothermal aging on the morphology and shear strength of Sn-5Sb solder reinforced with carbon nanotubes-Reference-Cited by-同舟云学术

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Investigating the effect of isothermal aging on the morphology and shear strength of Sn-5Sb solder reinforced with carbon nanotubes

Published:2015-11 Issue: Volume:649 Page:368-374
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Dele-Afolabi T.T.,Azmah Hanim M.A.,Norkhairunnisa M.,Yusoff H.M.,Suraya M.T.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference34 articles.

1. Lead-free Solders in Microelectronics

2. Http//www.jeita.or.jp. assessed 14 January 2014.

3. A Guide for Assembly of Lead-free Electronics;Roadmap,2000

4. Microstructural evolution and tensile properties of Sn–5Sb solder alloy containing small amount of Ag and Cu

5. Creep properties of Sn–Sb based lead-free solder alloys

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