Oxidation behavior of Sn–Zn solders under high-temperature and high-humidity conditions
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference26 articles.
1. Advances in lead-free electronics soldering
2. Progress in the design of new lead-free solder alloys
3. Wetting and interface microstructure between Sn–Zn binary alloys and Cu
4. Variable eutectic temperature caused by inhomogeneous solute distribution in Sn–Zn system
5. Microstructure and Mechanical Properties of Sn-8.55Zn-1Ag-XAl Solder Alloys
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