Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn–9Zn binary eutectic solder alloy
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference34 articles.
1. Issues in the replacement of lead-bearing solders
2. Microstructure and mechanical properties of Sn-In and Sn-Bi solders
3. The effect of aging on microstructure, room temperature deformation, and fracture of Sn-Bi/Cu solder joints
4. The properties of tin-bismuth alloy solders
5. Converting to lead-free solders: An automotive industry perspective
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3. Effect of Minor Sb Additions on Thermal Properties, Microstructure and Microhardness of Sn–Ag–Cu High-Temperature Solder Alloys;Physics of Metals and Metallography;2023-12-29
4. Evaluation of the microstructure, thermal, and mechanical characteristics of Sn-9Zn reinforced with Ni and ZrO2 nanoparticles via vacuum melting process;Physica Scripta;2023-09-05
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