Formation and growth of intermetallic phases in diffusion soldered Cu/In–Bi/Cu interconnections
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference11 articles.
1. Direct correlation between mechanical failure and metallurgical reaction in flip chip solder joints
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2. Microstructural observation of Bi67In reacting with Cu for microelectronic interconnects;Journal of the Taiwan Institute of Chemical Engineers;2023-10
3. Ag-(In-Bi) Solid–Liquid Interdiffusion Bonding;Journal of Electronic Materials;2022-11-29
4. Au-(In-Bi) and Ag-(In-Bi) Metallic Bonding for Temperature Sensitive Materials;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13
5. Review of microstructure and properties of low temperature lead-free solder in electronic packaging;Science and Technology of Advanced Materials;2020-01-31
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