Mixed mode fatigue crack growth at 550°c under plane stress conditions in Jethete M152
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference21 articles.
1. On the crack extension of plates under plane loading and transverse shear;Erdogan;J. bas. Engng,1963
2. A specimen geometry for plane mixed mode;Royer;Engng Fracture Mech.,1986
3. Dependence of mixed mode crack propagation on the variation of σrand τrθ;Crysakis;Engng Fracture Mech.,1986
4. Crack propagation rates in 7075-T6 plated under cyclic tensile and transverse shear loadings;Iida;J. bas. Engng,1969
5. Fatigue crack propagation from a crack inclined to the cyclic tensile axis;Tanaka;Engng Fracture Mech.,1974
Cited by 38 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. A review of mixed mode I-II fracture criteria and their applications in brittle or quasi-brittle fracture analysis;Theoretical and Applied Fracture Mechanics;2023-04
2. Experimental and numerical investigation of mixed-mode fatigue crack growth in nickel-based superalloy at high temperature;Engineering Fracture Mechanics;2022-10
3. Influence of initial crack on fatigue crack propagation with mixed mode in U71Mn rail subsurface;Engineering Failure Analysis;2022-06
4. Effect of notch depth ratio on mode I and mixed mode I-II fracture properties of engineered cementitious composites (ECC);International Journal of Solids and Structures;2022-02
5. The effect of residual stress on mixed‐mode crack propagation behaviour in friction stir welded 7075‐T6 aluminium alloy panel under biaxial loading;Fatigue & Fracture of Engineering Materials & Structures;2021-01-11
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3