Crosslink network rearrangement via reactive encapsulation of solvent in epoxy curing: A combined molecular simulation and experimental study
Author:
Funder
Materials in Extreme Dynamic Environments (MEDE) Consortium
US Army Research Lab
National Science Foundation
Publisher
Elsevier BV
Subject
Polymers and Plastics,Materials Chemistry,Organic Chemistry
Reference26 articles.
1. Epoxy resins chemistry and technology;May,1987
2. The epoxy book,2000
3. Handbook of epoxy resins;Lee,1982
4. Advanced composite mold making;Morena,1988
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