Organosoluble thermoplastic polyimide with improved thermal stability and UV absorption for temporary bonding and debonding in ultra-thin chip package-Reference-Cited by-同舟云学术

Organosoluble thermoplastic polyimide with improved thermal stability and UV absorption for temporary bonding and debonding in ultra-thin chip package

Published:2022-03 Issue: Volume:244 Page:124660
ISSN:0032-3861
Container-title:Polymer
language:en
Short-container-title:Polymer

Author:

Liu Jinshan,Li Jinhui,Wang Tao,Huang Dongxu,Li Zhipeng,Zhong Ao,Liu Wen,Sui Yuying,Liu Qiang,Niu Fangfang,Zhang Guoping,Sun Rong

Publisher

Elsevier BV

Subject

Polymers and Plastics,Materials Chemistry,Organic Chemistry

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5. A comprehensive study of pyrazine-contained and low-temperature curable polyimide;Li;Polymer,2021

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