Author:
Li Changqing,Wang Yunxia,Yin Yuyang,Li Yingying,Li Jinhui,Sun Deliang,Lu Jibao,Zhang Guoping,Sun Rong
Funder
National Natural Science Foundation of China
CAS Youth Innovation Promotion
Guangdong Department of Science and Technology
Subject
Polymers and Plastics,Materials Chemistry,Organic Chemistry
Reference45 articles.
1. Comparative evaluations on scallop-induced electric-thermo-mechanical reliability of through-silicon-vias;Cheng;Microelectron. Reliab.,2019
2. Representative volume element analysis for wafer-level warpage using Finite Element methods;Baek;Mater. Sci. Semicond. Process.,2019
3. Investigation on die shift issues in the 12-in wafer-level compression molding process, components, packaging and manufacturing technology;bu;IEEE Trans.,2013
4. Development of novel high density system integration solutions in FOWLP-complex and thin wafer-level SiP and wafer-level 3D packages;Cardoso,2017
5. Recent progress in low temperature curable photosensitive dielectrics;Enomoto,2017
Cited by
28 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献