A representation points based method for object detection on the surface of electroplated diamond wire saw-Reference-Cited by-同舟云学术

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A representation points based method for object detection on the surface of electroplated diamond wire saw

Published:2023-12 Issue: Volume:107 Page:57-64
ISSN:1526-6125
Container-title:Journal of Manufacturing Processes
language:en
Short-container-title:Journal of Manufacturing Processes

Author:

Zhao Yukang,Ge Peiqi,Bi Wenbo,Zheng Jintao

Funder

Key Technology Research and Development Program of Shandong Province

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management

Reference43 articles.

1. A material removal coefficient for diamond wire sawing of silicon;Wallburg;Wear,2022

2. Modeling of electroplated diamond wire and its application towards precision slicing of semiconductors;Ge;J Manuf Process,2023

3. Interaction of lateral cracks in double scratching of single-crystal silicon carbide;Wang;Theor Appl Fract Mech,2019

4. Generation of diamond wire sliced wafer surface based on the distribution of diamond grits;Chung;Int J Precis Eng Manuf,2014

5. Experiment study on electroplated diamond wire saw slicing single-crystal silicon;Gao;Mater Sci Semicond Process,2016

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