Research on the interfacial microstructure and mechanical properties of glass/Mg joint prepared by anodic bonding and vacuum diffusion bonding

Author:

Chou Zhao,Hu Lifang,Cheng Xiao,Mu Wenjin,Jia Weijie,Zhao Ruoxuan,Hou Zhiyong

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference49 articles.

1. Development trends and perspectives of future sensors and MEMS/NEMS;Zhu;Micromachines (Basel),2019

2. Anodic bonding;Knowles;Int Mater Rev,2013

3. Ultra-low temperature anodic bonding of silicon and glass based on nano-gap dielectric barrier discharge;Yao;J Cent South Univ,2021

4. A batch fabricated capacitive pressure sensor with an integrated Guyton capsule for interstitial fluid pressure measurement;Maleki;J Micromech Microeng,2011

5. Interfacial investigation and mechanical properties of glass-Al-glass anodic bonding process;Hu;J Micromech Microeng,2017

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