Author:
Pandey Harsh,Singh Tarlochan,Dixit Pradeep
Subject
Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management
Reference37 articles.
1. High aspect ratio vertical through-vias for 3D MEMS packaging applications by optimized three-step deep RIE;Dixit;J Electrochem Soc,2008
2. The development and evaluation of RF TSV for 3D IPD applications;Ebefors,2013
3. Design and fabrication of through-glass via (TGV) based 3D spiral inductors in fused silica substrate;Kannojia;Microsyst Technol,2022
4. Fabrication and electrical characterization of high aspect ratio poly-silicon filled through-silicon vias;Dixit;J MicromechMicroeng,2012
5. Strategies in deep wet etching of Pyrex glass;Iliescu;Sensors ActuatorsA Phys,2007
Cited by
11 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献