A systematic literature review: The effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints-Reference-Cited by-同舟云学术

A systematic literature review: The effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints

Published:2022-11 Issue: Volume:83 Page:68-85
ISSN:1526-6125
Container-title:Journal of Manufacturing Processes
language:en
Short-container-title:Journal of Manufacturing Processes

Author:

Ismail N.,Atiqah A.,Jalar A.,Bakar M.A.,Rahim R.A.A.,Ismail A.G.,Hamzah A.A.,Keng L.K.

Funder

Universiti Kebangsaan Malaysia

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management

Reference135 articles.

1. Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition;Ismail;Solder Surf Mt Technol,2021

2. Effect of ag nanoparticles on microstructure, damping property and hardness of low melting point eutectic tin–bismuth solder;Gain;J Mater Sci Mater Electron,2017

3. Topics in lead-free solders: restriction of hazardous substances recast (RoHS2);Chada;JOM,2013

4. High lead solder (over 85%) solder in the electronics industry: RoHS exemptions and alternatives;Menon;J Mater Sci Mater Electron,2015

5. Lead contamination of drinking water: metals leaching from soldered pipes may pose health hazard;Subramanian;J Environ Health,1991

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