Fan-out panel-level package warpage and reliability analyses considering the fabrication process-Reference-Cited by-同舟云学术

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Fan-out panel-level package warpage and reliability analyses considering the fabrication process

Published:2024-06 Issue: Volume:119 Page:649-665
ISSN:1526-6125
Container-title:Journal of Manufacturing Processes
language:en
Short-container-title:Journal of Manufacturing Processes

Author:

Liang Chia-Wei,Sung Yu-Chi,Hwang Sheng-Jye,Shih Ming-Hsiang,Liao Wen-Hsiang,Lin Te-Hsun,Yang Dong-Yan

Publisher

Elsevier BV

Reference18 articles.

1. System in wafer-level package technology with RDL-first process;Motohashi,2011

2. Panel-level fan-out RDL-first packaging for heterogeneous integration;Lau;IEEE Trans Compon Packag Manuf Technol,2020

3. Large area compression molding for fan-out panel level packing;Braun,2015

4. Study of warpage due to PVTC relation of EMC in IC packaging;Hong;IEEE Transactions on Components and Packaging Technologies,2004

5. Study of PVTC relation of EMC;Chang;J Electron Package,2002

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