Study on subsurface damage behavior in ductile ultra-precision grinding of sapphire based on acoustic emission signal processing

Author:

Wang Sheng,Wang Sheng,Wang Shu,Zhao Qingliang

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management

Reference62 articles.

1. Sapphire: material, manufacturing, applications [M];Dobrovinskaya,2009

2. Evaluation of grinding characteristics for sapphire ultra-precision grinding using small grit sizes wheels based on AE signals[J];Wang;Journal of Manufacturing Processes,2023

3. Freeform optical manufacturing and testing processes for IR conformal window and domes[C]//Window and Dome Technologies and Materials XIV;Medicus;SPIE,2015

4. Material removal mechanism of sapphire substrates with four crystal orientations by double-sided planetary grinding[J];Wang;Ceram Int,2020

5. Luo Q, Lu J, Xu X, et al. Removal mechanism of sapphire substrates (0001, 112¯0 and 101,¯0) in mechanical planarization machining[J]. Ceram Int, 2017, 43(18): 16178–16184.

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