Surface oxide films on Aluminum bondpads: Influence on thermosonic wire bonding behavior and hardness-Reference-Cited by-同舟云学术

Surface oxide films on Aluminum bondpads: Influence on thermosonic wire bonding behavior and hardness

Published:2000-08 Issue:8-10 Volume:40 Page:1515-1520
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Petzold M.,Berthold L.,Katzer D.,Knoll H.,Memhard D.,Meier P.,Lang K.-D.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Application of atomic force microscopy for microindentation testing;Petzold;Thin Solid Films,1995

2. Thickness Determination of Ultra-Thin Al2O3 Layers on Al by Means of EDX Measurements;Erfurth,1994

3. Einsatz der Rasterkraftmikroskopie für die Härteprüfung;Petzold;DVM-Report Nr. 517 “Rastermikroskopie in der Werkstoffprüfung”,1996

4. ISO 14577, DIN 50359.

5. Katzer D, Knoll H, Memhard D, Petzold M, Meier P and Lang KD. Bewertungsverfahren zur Charakterisierung von Drahtbondpad-Metallisierungen. IWM Rep. T8/2000, Fraunhofer-Institut für Werkstoffmechanik Halle.

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