Author:
Moon Seok Hwan,Hwang Gunn,Yun Ho Gyeong,Choy Tae Goo,Kang Young II
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference8 articles.
1. Transient characteristics of a two-phase thermosyphon loop for multichip module;Nam;ETRI J,1998
2. Cooling of CPU using micro heat pipe;Eguchi;Fujikura Co Tech Note,1997
3. Xie H. The use of heat pipes in the cooling of portables with high power packages. Thermacore Co. Technical Note, 1995
4. Steady-state modeling and testing of a micro heat pipe;Babin;J Heat Transfer,1990
5. Thermal analysis of a micro heat pipes;Kurustalev;J Heat Transfer,1993
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