Heat resistant polyimide films with low dielectric constant by vapor deposition polymerization-Reference-Cited by-同舟云学术

Heat resistant polyimide films with low dielectric constant by vapor deposition polymerization

Published:1997-10 Issue: Volume:308-309 Page:475-479
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Ukishima Sadayuki,Iijima Masayuki,Sato Masatoshi,Takahashi Yoshikazu,Fukada Eiichi

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. X. Zhang, L. You, S.Dabral, C. Chiang, D.S. Yaney, R.V. Joshi, G.R. Yang, T.M. Lu and J.F. McDonald, Planarizing Techniques for Parylene as an Interlayer Dielectric, Proc. VMIV (1993) 168.

2. Y. Takahashi, M. lijima, K. lnagawa and A. ltoh, J.Vac.Sci. Technol., A5, (1987) 2253.

3. R. Salem, F.O. Sequed, J. Duran and W.Y.J. Lee, J.Vac.Sci. Technol., A4 (1986) 369.

4. T. Strunskus and M. Grunze, in M. Ghosh and K. Mittal (eds.), Polyimides, Dekker, New York, 1996, p. 187.

5. Y.Y. Maruo. Y. Andoh and S. Sasaki, J. Vac. Sci. Technol., A11(5) (1993), 2590.

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