The analysis of thermal stress effect on electromigration failure time in Al alloy thin-film interconnects
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference13 articles.
1. Grain size dependence of electromigration‐induced failures in narrow interconnects
2. Improving electromigration reliability in Al-alloy lines
3. The role of texture in the electromigration behavior of pure aluminum lines
4. Electromigration in Al(Cu) two‐level structures: Effect of Cu and kinetics of damage formation
5. Electromigration in thin aluminum films on titanium nitride
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