A review of the thermal conductivity of silver-epoxy nanocomposites as encapsulation material for packaging applications-Reference-Cited by-同舟云学术

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A review of the thermal conductivity of silver-epoxy nanocomposites as encapsulation material for packaging applications

Published:2022-10 Issue: Volume:446 Page:137319
ISSN:1385-8947
Container-title:Chemical Engineering Journal
language:en
Short-container-title:Chemical Engineering Journal

Author:

Sun Zhijian,Li Jiaxiong,Yu Michael,Kathaperumal Mohanalingam,Wong Ching-Ping

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,General Chemical Engineering,Environmental Chemistry,General Chemistry

Reference117 articles.

1. Thermal conductivity of polymer-based composites: Fundamentals and applications;Chen;Prog. Polym. Sci.,2016

2. Exfoliated hexagonal boron nitride-based polymer nanocomposite with enhanced thermal conductivity for electronic encapsulation;Lin;Compos. Sci. Technol.,2014

3. Thermal, mechanical and dielectric properties of flexible BN foam and BN nanosheets reinforced polymer composites for electronic packaging application;Fang;Compos. Part A Appl. Sci. Manuf.,2017

4. Mussel-tailored carbon fiber/carbon nanotubes interface for elevated interfacial properties of carbon fiber/epoxy composites;Wu;Chem. Eng. J.,2022

5. Designing advanced 0D–2D hierarchical structure for Epoxy resin to accomplish exceeding thermal management and safety;Lu;Chem. Eng. J.,2022

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