Sweat-adaptive adhesive hydrogel electronics enabled by dynamic hydrogen bond networks
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Published:2024-07
Issue:
Volume:492
Page:152290
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ISSN:1385-8947
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Container-title:Chemical Engineering Journal
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language:en
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Short-container-title:Chemical Engineering Journal
Author:
Wang SihengORCID,
Wang Zhuomin,
Zhang LeiORCID,
Song Zhanqian,
Liu HeORCID,
Xu Xu