Rapid sintering of nano-Ag paste at low current to bond large area (>100 mm2) power chips for electronics packaging-Reference-Cited by-同舟云学术

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Rapid sintering of nano-Ag paste at low current to bond large area (>100 mm2) power chips for electronics packaging

Published:2018-05 Issue: Volume:255 Page:644-649
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Xie Yijing,Wang Yanjie,Mei Yunhui,Xie Haining,Zhang Kun,Feng Shuangtao,S Siow Kim,Li Xin,Lu Guo-Quan

Funder

National High Technology Research and Development Program of China

National Natural Science Foundation of China

Science and Technology Program of Tianjin, China

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites

Reference28 articles.

1. Reliability comparison between SAC305 joint and sintered nanosilver joint at high temperatures for power electronic packaging;Chen;J. Mater. Process. Tech.,2014

2. Test of IGBT junction-case steady state thermal resistance and experimental analysis;Chen;Int. Conf. Intell. Syst. Des. Eng. Appl.,2011

3. Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300 °C;Chua;J. Alloy Compd.,2016

4. Characterizations of rapid sintered nanosilver joint for attaching power chips;Feng;Mater,2016

5. Pressureless sintering of nanosilver paste at low temperature to join large area (≥100 mm2) power chips for electronic packaging;Fu;Mater. Lett.,2014

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1. Microstructure characteristics for improved thermal shock reliability of sintered Ag Al paste in SiC power module;Materials Characterization;2024-11

2. High-Pressure-Assisted Large-Area (>2400 mm2) Sintered-Silver Substrate Bonding for SiC Power Module Packaging;Materials;2024-04-20

3. Atomic insight in fusion mechanism of heterogeneous and homogeneous sintering: Cu and Ag nanoparticles;Results in Physics;2024-02

4. Surface modification of Ag-coated Cu particles using dicarboxylic acids to enhance the electrical conductivity of sintered films by suppressing dewetting in Ag shells;Applied Surface Science;2023-12

5. The effect of thinner SDS-coated Ag NPs and organic carrier PVAc on properties of low-temperature silver paste;Journal of Materials Research and Technology;2023-09

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