Study on subsurface damage and surface quality of silicon carbide ceramic induced by a novel non-resonant vibration-assisted roll-type polishing-Reference-Cited by-同舟云学术

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Study on subsurface damage and surface quality of silicon carbide ceramic induced by a novel non-resonant vibration-assisted roll-type polishing

Published:2020-08 Issue: Volume:282 Page:116667
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Chen Xiuyuan,Gu Yan^ORCID,Lin Jieqiong^ORCID,Yi Allen^ORCID,Kang Mingshuo,Cang Xinyu

Funder

National Natural Science of Foundation of China

Micro-Nano and Ultra Precision Key Laboratory of Jilin Province

Science and Technology Development Projects of Jilin Province

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites

Reference49 articles.

1. Experimental investigation of surface/subsurface damage formation and material removal mechanisms in SiC grinding;Agarwal;Int. J. Mach. Tool. Manu.,2008

2. Grinding characteristics, material removal and damage formation mechanisms in high removal rate grinding of silicon carbide;Agarwal;Int. J. Mach. Tool. Manu.,2010

3. Ductile-regime grinding: a new technology for machining brittle materials;Bifano;J. Manuf. Sci. Eng.,1991

4. Finishing of structured surfaces by abrasive polishing;Brinksmeier;Precis. Eng.,2006

5. Study on the material removal process in ultrasonic-assisted grinding of SiC ceramics using smooth particle hydrodynamic (SPH) method;Cao;Int. J. Adv. Manuf. Technol.,2016

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1. Simulation and experimental investigation of material removal profile based on ultrasonic vibration polishing of K9 optical glass;Tribology International;2024-08

2. Molecular simulation of ultrasonic assisted diamond grit scratching 4H-SiC single-crystal;Tribology International;2024-04

3. Scale dependence analysis of two-dimensional vibrational polishing of shaped holes for aerospace heat dissipation;Applied Thermal Engineering;2024-04

4. Atomic-scale smoothing of semiconducting oxides via plasma-enabled atomic-scale reconstruction;International Journal of Machine Tools and Manufacture;2024-03

5. Design, analysis, and testing of a new asymmetric vibration-assisted stage for roll-type polishing;Review of Scientific Instruments;2023-12-01

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