In-situ study of creep in Sn-3Ag-0.5Cu solder
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference54 articles.
1. Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys;Moon;J. Electron. Mater.,2000
2. In Situ Optical Creep Observation of Joint-Scale Tin–Silver–Copper Solder Shear Samples;Herkommer;J. Electron. Mater.,2009
3. In situ observations on creep fatigue fracture behavior of Sn–4Ag/Cu solder joints;Zhang;Acta Mater.,2011
4. Creep properties of Sn-Ag solder joints containing intermetallic particles;Choi;JOM,2001
5. Sn-Ag-Cu solder joint microstructure and orientation evolution as a function of position and thermal cycles in ball grid arrays using orientation imaging microscopy;Lee;J. Electron. Mater.,2010
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