Electrodeposition of tin-rich Cu–Sn alloys from a methanesulfonic acid electrolyte-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Electrodeposition of tin-rich Cu–Sn alloys from a methanesulfonic acid electrolyte

Published:2013-02 Issue: Volume:90 Page:498-506
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Pewnim N.,Roy S.

Publisher

Elsevier BV

Reference72 articles.

1. The Electrodeposition of Tin and its Alloys;Jordan,1999

2. Modern Electroplating;Schlesinger,2010

3. OJEU, L37 (2003).

4. Lead-free solders in microelectronics;Abtew;Materials Science and Engineering R: Reports,2000

5. Cu–Sn coatings obtained from pyrophosphate-based electrolytes;Correia;Surface and Coatings Technology,2007

Cited by 66 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect and mechanism of mercaptobenzoheterocyclic derivatives as brighteners in acid sulfate tin electroplating;Electrochimica Acta;2025-08

2. Mechanical properties of Cu-Ni alloy thick films electrodeposited from aqueous solution containing pyrophosphate as a complexing agent;Journal of Alloys and Compounds;2025-05

3. Electrodeposition and Corrosion Behavior of Cu-Sn Alloys in 3.5 wt.% NaCl and 0.1 M HNO3 Solutions;Metals;2025-04-10

4. Direct electrochemical co-polymerization of EDOT and hydroquinone;Journal of Materials Chemistry A;2025

5. Production of Cu-Sn Alloy Coatings Onto AISI 1020 Carbon Steel Substrate Using Sodium Citrate Bath and SPC Electrodeposition;Materials Research;2025

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.7亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP