Electrochemical behaviors of Janus Green B in through-hole copper electroplating: An insight by experiment and density functional theory calculation using Safranine T as a comparison-Reference-Cited by-同舟云学术

Electrochemical behaviors of Janus Green B in through-hole copper electroplating: An insight by experiment and density functional theory calculation using Safranine T as a comparison

Published:2013-03 Issue: Volume:92 Page:356-364
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Wang Chong,Zhang Jinqiu,Yang Peixia,An Maozhong

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference47 articles.

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3. Influence of molecular weight of polyethylene glycol on microvia filling by copper electroplating;Dow;Journal of the Electrochemical Society,2005

4. Aspect-ratio-dependent copper electrodeposition technique for very high aspect-ratio through-hole plating;Pradeep Dixit;Journal of the Electrochemical Society,2006

5. Modeling of additive effects on the electroplating of a through-hole;Hazlebeck;AIChE Journal,1990

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