Electrolyte ohmic heating during electrodeposition: The role of coupled kinetic-transport phenomena that lead to morphological and microstructural changes-Reference-Cited by-同舟云学术

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Electrolyte ohmic heating during electrodeposition: The role of coupled kinetic-transport phenomena that lead to morphological and microstructural changes

Published:2023-09 Issue: Volume:462 Page:142616
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Eribol Pınar^ORCID,Gopalakrishnan Sarathy K.^ORCID,Diwakar S.V.,Talbi Abdelkrim,Narayanan Ranga,Zoueshtiagh Farzam^ORCID,Ziegler Kirk J.^ORCID

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference56 articles.

1. The mechanism of electrolytic metal deposition;Conway;Proc. R. Soc. A,1958

2. Mechanism of electrodeposition and dissolution processes of copper in aqueous solutions;Bockris;Trans. Faraday Soc.,1962

3. The rate-determining step in the electro-deposition of copper on copper from aqueous cupric sulphate solutions;Brown;Electrochim. Acta,1965

4. Electrodeposition of copper under microgravity conditions;Fukunaka;J. Electrochem. Soc.,1998

5. Galvanostatic studies of the kinetics of deposition and dissolution in the copper+ copper sulphate system;Mattsson;Trans. Faraday Soc.,1959

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