Room temperature bonding of Au plating through surface smoothing using polyimide template stripping-Reference-Cited by-同舟云学术

Room temperature bonding of Au plating through surface smoothing using polyimide template stripping

Published:2025-03 Issue: Volume:383 Page:116211
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Takeuchi Kai^ORCID,Koseki Shogo,Thu Le Hac Huong,Matsumae Takashi,Takagi Hideki,Kurashima Yuichi,Tsuda Takahiro,Tokuhisa Tomoaki,Shimizu Toshikazu,Higurashi Eiji^ORCID

Funder

Japan Science and Technology Agency

Publisher

Elsevier BV

Reference32 articles.

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4. Low-temperature bonding of laser diode chips on silicon substrates using plasma activation of Au films;Higurashi;IEEE Photonics Technol. Lett.,2007

5. T. Matsumae, K. Yuichi, E. Higurashi, H. Takagi, Surface activated bonding of Au/Ta layers after degas annealing for MEMS packaging, in: 2018 International Conference on Electronics Packaging and IMAPS All Asia Conference, ICEP-IAAC, 2018, pp. 270–275.

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1. Smoothing of Plated Au Bumps Based on Template-Stripping for Low-Temperature Bonding;2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC);2025-04-15

2. Wafer Bonding of GaAs and SiC via Thin Au Film at Room Temperature;Micromachines;2025-04-07