Development of wafer scale encapsulation process for large displacement piezoresistive MEMS devices-Reference-Cited by-同舟云学术

Development of wafer scale encapsulation process for large displacement piezoresistive MEMS devices

Published:2009-12 Issue:2 Volume:156 Page:275-283
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Ayanoor-Vitikkate Vipin,Chen Kuan-lin,Park Woo-Tae,Kenny Thomas W.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference19 articles.

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3. H. Guckel, Sealed cavity semiconductor pressure transducers and method of producing the same, US 4,853,669.

4. Three-dimensional micromachining of silicon pressure sensor integrating resonant strain gauge on diaphragm;Ikeda;Sensors and Actuators A: Physical,1990

5. Characterization of silicon oxide etching in HF vapor process;Han,1997

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