Underwater and water-assisted laser processing: Part 2—Etching, cutting and rarely used methods-Reference-Cited by-同舟云学术

Underwater and water-assisted laser processing: Part 2—Etching, cutting and rarely used methods

Published:2004-02 Issue:2 Volume:41 Page:329-352
ISSN:0143-8166
Container-title:Optics and Lasers in Engineering
language:en
Short-container-title:Optics and Lasers in Engineering

Author:

Kruusing Arvi

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference124 articles.

1. Kruusing A. Underwater and water-assisted laser processing. Part 1. General features, steam cleaning and shock processing. (This issue: PII: S0143-8166(02)00142-2).

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4. Micromachining by laser ablation of liquid;Wang;Proc SPIE,2000

5. Increase of efficiency for the XeCl excimer laser ablation of ceramics;Geiger;Appl Surf Sci,1996

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