Improved diffusion barrier performance of Ru/TaN bilayer by N effusion in TaN underlayer
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science
Reference33 articles.
1. Barrier capability of Zr–N films with titanium addition against copper diffusion
2. Effect of density on the diffusion barrier property of TiNx films between Cu and Si
3. Diffusion barrier property of TaN between Si and Cu
4. Electrodeposition of Cu on Ru Barrier Layers for Damascene Processing
5. Characteristics of a 10nm-thick (TiVCr)N multi-component diffusion barrier layer with high diffusion resistance for Cu interconnects
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