Funder
Korea Advanced Institute of Science and Technology (N01150138)
Samsung Electronics Co., Ltd
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference21 articles.
1. Introduction to semiconductor manufacturing technology;Xiao,2012
2. Grinding induced subsurface cracks in silicon wafers;Pei;Int J Mach Tool Manuf,1999
3. Cost effective IC manufacturing;Peters,1995
4. Crack detection in single-crystalline silicon wafers using impact testing;Hilmersson;Appl Acoust,2008
5. On-chip eddy current sensor for proximity sensing and crack detection;Sadler;Sens Actuator A Phys,2001
Cited by
36 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献