Subject
Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference27 articles.
1. Die singulation technologies for advanced packaging: a critical review;Lei;J. Vacuum Sci. Technol. B Nanotechnol. Microelectronics: Mater., Process., Measure., Phenomena,2012
2. Investigation of chipping and wear of silicon wafer dicing;Lin;J. Manuf. Processes,2014
3. Microstructural, mechanical, fractural and electrical characterization of thinned and singulated silicon test die;Majeed;J. Micromech. Microeng.,2006
4. C. Fornaroli, J. Holtkamp, A. Gillner, Dicing of thin silicon wafers with ultra-short pulsed lasers in the range from 200 fs up to 10 ps, JLMN 10 (2015) 229–33.
5. A. Hooper, J. Ehorn, M. Brand, C. Bassett, Review of wafer dicing techniques for via-middle process 3DI/TSV ultrathin silicon device wafers, in: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (IEEE), 2015, pp. 1436–46.
Cited by
17 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献