Effects of Ag on Properties of Sn-9Zn Lead-Free Solder
Author:
Publisher
Elsevier BV
Subject
General Medicine
Reference16 articles.
1. Effects of aging on structural evolution of the rapidly solidified Sn–Ag–Zn eutectic solder
2. Microstructural evolution of ɛ-AgZn3 and η-Zn phases in Sn–8.5Zn–0.5Ag–0.01Al–0.1Ga solder during aging treatment
3. The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn–8.55Zn–0.5Ag–0.1Al–xGa solders and Cu
4. Microstructure and tensile properties of Sn–9Zn–xAg lead-free solder alloys
5. Effect of temperature on microstructural changes of the Sn–9wt.% Zn lead-free solder stripe under current stressing
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3. Mechanical and Electrical Properties of Some Sn-Zn Based Lead-Free Quinary Alloys;Materials Sciences and Applications;2024
4. Phase Evolution at the Interface between Liquid Solder Sn-Zn-Ag and Cu Substrate Studied by In Situ Heating Scanning Transmission Electron Microscopy;Journal of Materials Engineering and Performance;2023-05-22
5. Study on the effects of Ag addition on the mechanical properties and oxidation resistance of Sn–Zn lead-free solder alloy by high-throughput method;Journal of Materials Science: Materials in Electronics;2023-01-31
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