Funder
Natural Science Foundation of Chongqing
National Key Research and Development Program of China
Fundamental Research Funds for the Central Universities
Natural Science Foundation Project of Chongqing
National Natural Science Foundation of China
Reference139 articles.
1. Recent advances and trends in advanced packaging;Lau;IEEE Trans. Components, Packaging and Manufact. Technol.,2022
2. Semiconductor Advanced Packaging;Lau,2021
3. 3D IC Integration and Packaging;Lau,2016
4. Advanced packaging technologies for heterogeneous integration;Mahajan,2021
5. A revolution on the horizon from DARPA: heterogeneous integration for revolutionary microwave\/millimeter-wave circuits at DARPA: progress and future directions";Green;IEEE Microw. Mag.,2017
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