Contribution of ultrasonic traveling wave to chemical–mechanical polishing-Reference-Cited by-同舟云学术

Contribution of ultrasonic traveling wave to chemical–mechanical polishing

Published:2015-02 Issue: Volume:56 Page:530-538
ISSN:0041-624X
Container-title:Ultrasonics
language:en
Short-container-title:Ultrasonics

Author:

Li Liang,He Qing,Zheng Mian,Liu Zheng

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Acoustics and Ultrasonics

Reference26 articles.

1. Markus Forsberg. Chemical Mechanical Polishing of Silicon and Silicon Dioxide in Front End Processing. Acta Universitatis Upsaliensis Uppsala, 2004.

2. Chemical–Mechanical Planarization of Semiconductor Materials;Oliver,2004

3. CMP challenge below a quarter micron;Dejule;Semicond. Int.,1997

4. Modeling of chemical–mechanical polishing with soft pads;Shi;Appl. Phys. A,1998

5. Superior chemical–mechanical polishing performance of silica slurry made of surface-active siloxane/acrylic polymers;Kuo;Colloid Polym. Sci.,2001

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