Cyclic loading behavior of micro-sized polycrystalline copper wires
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics
Reference26 articles.
1. Size effects in materials due to microstructural and dimensional constraints: A comparative review;Arzt;Acta Mater,1998
2. Miniaturized single-crystalline fcc metals deformed in tension: New insights in size-dependent plasticity;Dehm;Prog Mater Sci,2009
3. Dependence of nanohardness upon indentation size and grain size. A local examination of the interaction between dislocations and grain boundaries;Yang;Acta Mater,2007
4. The deformation-induced zone below large and shallow nanoindentations: A comparative study using EBSD and TEM;Rester;Phil Mag Lett,2008
5. Microstructural interpretation of negligible strain-hardening behavior of submicrometer-grained low-carbon steel during tensile deformation;Park;Metall Mater Trans A,2002
Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Fatigue life assessment of metal foils in multifunctional composites via combined experiments and simulations;Composites Part B: Engineering;2023-06
2. Rate limiting deformation mechanisms of bcc metals in confined volumes;Acta Materialia;2019-03
3. Revealing the role of microstructure architecture on strength and ductility of Ni microwires by in-situ synchrotron X-ray diffraction;Scientific Reports;2019-01-11
4. Progress in ultrasonic bonding wire process and quality evaluation of bonding point;AOPC 2017: Optical Sensing and Imaging Technology and Applications;2017-10-24
5. Evaluation of Thin Copper Wire and Lead-Free Solder Joint Strength by Pullout Tests and Wire Surface Observation;Crystals;2017-08-20
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3