1. Special article: Fhantasmagorical Wire-Less, Nikkei Electronics No.918, 87-106, 2006/01/30, (Japanese).
2. Special article: WiGig Fly away! Nikkei Electronics No.1123, 2013/12/09, (Japanese).
3. Microwave materials with high Q and low dielectric constant for wireless communications;Ohsato;Mater. Res. Soc. Symp. Proc.,2005
4. Fine Ceramics Center (JFCC): Report of Support Industrial Project 2010, R&D for Ceramics Substrates with Low Thermal Expansion and High Thermal Conductivity, METI Chubu Bureau of Economy, Trade and Industry, 2010/3, (Japanese), .
5. Analysis of the low thermal expansion mechanism of preferably oriented;Ogata;DENSO Tech. Rev.,2008