Microstructure, joining mechanism, mechanical properties and optimization of inactive solder (Sn9Zn) in low temperature ultrasonic soldering of AlN ceramics and 2024Al
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Published:2024-08
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ISSN:0272-8842
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Container-title:Ceramics International
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language:en
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Short-container-title:Ceramics International
Author:
Fan ZongkaiORCID,
Chen ChaoORCID