Microstructure, joining mechanism, mechanical properties and optimization of inactive solder (Sn9Zn) in low temperature ultrasonic soldering of AlN ceramics and 2024Al-Reference-Cited by-同舟云学术

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Microstructure, joining mechanism, mechanical properties and optimization of inactive solder (Sn9Zn) in low temperature ultrasonic soldering of AlN ceramics and 2024Al

Published:2024-08 Issue: Volume: Page:
ISSN:0272-8842
Container-title:Ceramics International
language:en
Short-container-title:Ceramics International

Author:

Fan Zongkai^ORCID,Chen Chao^ORCID

Publisher

Elsevier BV

Reference51 articles.

1. Review-progress in electrochemical etching of third-generation semiconductors;Chen;Ecs Journal of Solid State Science and Technology,2023

2. Progress of high strength and high thermal conductivity Si3N4 ceramics for power module packaging;Fu;J. Inorg. Mater.,2023

3. Effects of large-temperature cycling range on direct bond aluminum substrate;Lei;IEEE Trans. Device Mater. Reliab.,2009

4. Development of a directly bonded aluminum/alumina power electronic substrate;Ning;Materials Science and Engineering B-Solid State Materials for Advanced Technology,2003

5. Aging effect on high heat dissipation DBA and DBAC substrates for high power electronics;Chen;Ceram. Int.,2022

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