Rapid preparation of Si3N4 ceramics with high thermal conductivity and low dielectric loss by fast hot-pressing (FHP) sintering-Reference-Cited by-同舟云学术

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Rapid preparation of Si3N4 ceramics with high thermal conductivity and low dielectric loss by fast hot-pressing (FHP) sintering

Published:2024-10 Issue:20 Volume:50 Page:38550-38561
ISSN:0272-8842
Container-title:Ceramics International
language:en
Short-container-title:Ceramics International

Author:

Wang Ruoyu,Qin Tianying,Shang Yijing,Wang Mingxia,Li Enzhu,Zhong Chaowei

Funder

National Natural Science Foundation of China

University of Electronic Science and Technology of China State Key Laboratory of Electronic Thin Films and Integrated Devices

Publisher

Elsevier BV

Reference45 articles.

1. Opportunities for enhancing the thermal conductivities of SiC and Si3N4 ceramics through improved processing;Haggerty,1995

2. Molecular dynamics calculation of the ideal thermal conductivity of single-crystal α-and β-Si3N4;Hirosaki;Phys. Rev. B,2002

3. Effect of nano-sized sintering additives on microstructure and mechanical properties of Si3N4 ceramics;Kumar;Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process.,2019

4. Fabrication of high thermal conductivity silicon nitride ceramics by pressureless sintering with MgO and Y2O3 as sintering additives - ScienceDirect;Lu;Ceram. Int.,2020

5. Effect of the Y2O3 additive concentration on the properties of a silicon nitride ceramic substrate;Liu;Ceram. Int.,2016

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