Atomic-level insights into CeO2 performance: Chemical interactions in CMP explored through CeO2-SiO2 studies-Reference-Cited by-同舟云学术

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Atomic-level insights into CeO2 performance: Chemical interactions in CMP explored through CeO2-SiO2 studies

Published:2024-08 Issue: Volume: Page:
ISSN:0272-8842
Container-title:Ceramics International
language:en
Short-container-title:Ceramics International

Author:

Venkataswamy Ravitej^ORCID,Trimble Lyle,Ryu Seokgyu,Le Ngoc-Tram^ORCID,Park Kyungju,Kang Hyungoo,Seo Jihoon^ORCID

Funder

SK Hynix

Publisher

Elsevier BV

Reference46 articles.

1. The international technology roadmap for semiconductors—perspectives and challenges for the next 15 years;Arden;Curr. Opin. Solid State Mater. Sci.,2002

2. Advances in Chemical Mechanical Planarization (CMP);Babu,2021

3. A review on chemical and mechanical phenomena at the wafer interface during chemical mechanical planarization;Seo;J. Mater. Res.,2021

4. Nanoscale tribological aspects of chemical mechanical polishing: a review;Datta;Appl. Surface Sci. Adv.,2022

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