Bi-Cu film deposition in aqueous solutions

Author:

WADA Hitoshi,NISHISAKA Yasuhiro,ICHINO Ryoichi,OKIDO Masazumi

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics

Reference7 articles.

1. The lattice spacings of lead-rich substitutional solid solutions [J];TYZACK;Acta Cryst,1954

2. The determination of the compatibility of metals through static friction test [J];RABINOWICZ;ASLE Trans,1971

3. Plating for bearing applications [J];EASTHAM;Transactions of the Institute Metal Finishing,1982

4. Relationship between temperature distribution in EHL film and dimple formation [J];KAZUYUKI;Transactions of the ASME Journal of Tribology,2005

5. YOKOTA H, DESAKI T, HAYAKAWA H, HASHIZUME K, ITO H, INAYOSHI N, MURAKAMI Y, NOZU T, SUZUKI M. [C]// Proceedings of Automotive Engineers of Japan, 2005. 127-05.

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